Equipment model
• Rb100 series
Product features
• Multi-axis 4-axis horizontal multi-joint cleaning manipulator Rb100
series for ultra-clean room
• It is applicable to wafer handling of inspection device in 300mm
semiconductor manufacturing device
• Standard arm length of robot: 210mm, 280mm
• Robot arm can be correspond to 2 FOUPs separately
• Control communication mode: Serial port RS2320 or parallel port I/O
mode
• Wafer fi xing mode: Vacuum adsorption type, lower support type, edge
clamping type, Bernoulli non-contact fi nger
Technical specifi cation and parameter
• Articles handled: ≤ 300mm wafer
• Wafer absorption mode: Vacuum absorption
• Mechanical structure format: Horizontal multi-joint, control axis: 4
axes
• Motor type: AC servo motor
• Movable range: The arrival distance of the center of the articles handled
is 760mm; Rotation angle: (0 axis) 335° ; Lift (Z axis) 300mm
• Repeatability accuracy: Within ±0.1mm
• Factory service: Power supply: Single-phase AC200V; Vacuum: Better
than -53kPa (vacuum adsorption fi nger is used)
• Mass: Robot arm body is about 40kg |
