• Features wafer mapping, protrusion, stacking, and misalignment detection
• User-friendly touch control operation
• Compliant with SEMI S2 standards
Product Specifications
Model | LP160FP |
Wafer size | 12"Frame |
Carrier type | 12"Closed clean materialbox |
Size | 470X555X1200mm (WxDxH) |
Cleanliness | Class 1@0.1um |
Operation time | With mapping |
FOUP Open:18sec | |
FOUP Close:10sec | |
Communication | RS232/RS485/ETHERNET |
Optional component | RFID TI134kHz |
AMHS Communication Port(E84) | |
Power supply | DC24V 2A |
Negative pressure | -50~-80Kpa |
Positive pressure | 0.6~ -0.7Mpa |
Weight | 65Kg |
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