RB100ASA1-185-300-V01-DNN

Description

The RB100 Series is a dedicated wafer transfer robot developed by for the semiconductor industry, featuring fully independent intellectual property rights. The RB100 offers a diverse product lineup, including single-arm, dual-arm, end-flip, and waterproof models. Equipped with Is independently designed end-effectors, it ensures reliable transfer of wafers up to 300mm in various materials and thicknesses.

performance parameter

• Suitable for wafer transfer up to 300mm

• Capable of free-end trajectory and oblique insertion

• Fully independent intellectual property rights

• Modular design with customizable options

• Compliant with SEMI S2 standards

Product Specifications

Model	RB100ASA1-185-300-V01-DNN
Manipulator type	Single-arm
Applicable wafer size	≤ 300mm
Wafer suction method	Vacuum suction type, Bernoulli type, Clamp type, Composite type
Mechanical structure	Horizontal multi-joint
Control axes	3	Controller	ECB100S-3
Motor Type	AC servo motor
Motion range	Reaching distance from the center	Rotation angle (θ-axis)	Lifting(Z-axis)
Motion range	632.5mm	340°	300mm
Average handling speed	R-axis	θ-axis	Z-axis
Average handling speed	850mm/s	205°/s	330mm/s
Maximum transport speed	R-axis	θ-axis	Z-axis
Maximum transport speed	2200mm/s	270°/s	650mm/s
Repeatability accuracy	Within ±0.06mm
Control communication methods	RS232/RS485/TCP/IP
Cleanliness	ISO Standard class1 (under the condition of internal independent exha use of driving structure)
Factory Affairs	Power supply: AC220V 5A, Vacuum: Better than -53Kpa
Weight	≈ 30Kg

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RB100ASA1-185-300-V01-DNN

Description

performance parameter

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