AG106G

Description

Designed for wafer alignment in semiconductor production processes, it handles 6" to 12" wafers, including conventional, transparent, and semi-transparent wafers.

performance parameter


• High-speed, high-precision centering and notch positioning

• Compatible with transparent, semi-transparent, and opaque wafers

• Customizable development

• Compliant with SEMI S2 standards


Product Specifications


Model

AG106G

Product Structure

Mechanical clamping type

Sensor type

Reflective optical fiber

Wafer speclflcatlons

6"

Time required to determine position

2.5s (no re-clamping action is performed)

Position accuracy

Wafer center: within ±0.3mm, Notch positioning: within ±0.3°

Working scope

±5mm

Wafer holding method

Mechanical edge gripping

Wafer hold check

Limited reflection type optical fiber sensor (2 locations)

Control communication methods

RS232/RS485/TCP/IP

Power supply

DC24V 2A

Negative pressure

-

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