CSEAC 2026 Day One Highlights: SRT’s MicroFar Showcases Core Wafer Components

The 14th Semiconductor Equipment, Materials and Core Components Exhibition (CSEAC 2026) was held as scheduled from August 31 to September 2, 2026, at the Wuxi Taihu International Expo Center.

  • WFR, a brand under SRT, is showcasing at CSEAC 2026 in Hall A3, Booth 210

At CSEAC 2026, WFR, a brand under SRT, exhibited at Hall A3, Booth 210. Long committed to domestic substitution, WFR highlighted its wafer transfer systems and core components, and delivered reliable power output and drive solutions for the high-end precision manufacturing sector.

  • Industry clients visited the WFR booth to exchange ideas and hold discussions

WFR, a key strategic business unit of SRT in the semiconductor equipment sector, provides maturewafer transfer system solutions to customers across the semiconductor industry.

  • Core Equipment on Display, Drawing Inquiries from Industry Professionals





RB100V Vacuum Robot

Purpose-Built for Automated Wafer Transfer


The RB100V Vacuum Robot showcased at CSEAC 2026 is designed for wafer handling in vacuum environments. With a vacuum level of 5E-8 Torr, it enables stable and reliable handling of wafers up to 300 mm in diameter in high-vacuum, high-cleanliness environments.


  • Robot RB100V Vacuum Manipulator

ASW6000 Series Sorter

Wafer Lot Sorting and Transfer Management

The ASW6000 Series Sorter features fully independent intellectual property rights and is designed for wafer lot sorting and transfer management on production lines.


Backed by proprietary technologies for core components such as Robot, LoadPort, Aligner, and Fork, WFR has established a unique advantage in multi-scenario compatibility and can maintain a stable Class 1 cleanroom environment.


  • The robot is demonstrating the wafer transfer process to and from the LoadPort.

In addition to the above, WFR has developed key process equipment for ultra-thin wafer de-taping and die splitting. With a highly modular design and strong process adaptability, these systems provide customers with a more cost-effective domestic alternative.


As core drive components for wafer transfer systems and back-end packaging equipment, servo motors directly determine the process yield and efficiency of the entire semiconductor equipment through their positioning accuracy and operational stability. Therefore, during CSEAC 2026, WFR showcased a range of servo motor products for visiting customers, enabling flexible selection and matching according to their actual equipment requirements.

Servo motors are purpose-built for semiconductor applications. With an IP67 protection rating, they meet cleanroom requirements for dust and moisture protection. A stable speed of 3,000 rpm, combined with low torque fluctuation, meets repeat positioning accuracy requirements of ±0.02 mm. As domestically developed products with independent and controllable technology, they offer delivery lead times more than 60% shorter than those of imported brands. They are also compatible with mainstream industrial fieldbus protocols, enabling replacement and upgrading without production line modification. Their compact structure fits confined spaces, while Class F insulation and a fully enclosed design support 24/7 continuous operation. With power ranging from 0.1 kW to 0.75 kW, they can handle applications from light-load positioning to medium-load transfer.

In addition, the WFR booth featured a range of MT-FA fiber optic patch cords, offering low insertion loss, high-temperature resistance, and plug-and-play functionality.

  • Servo Motors, MT-FA Fiber Optic Patch Cords, and More on Display at Hall A3, Booth 210


At CSEAC 2026, numerous visitors and potential partners showed strong interest. WFR hopes to take this opportunity to join forces with industry professionals and continue advancing the independent R&D and engineering applications of semiconductor transfer equipment. Once again, WFR sincerely invites industry colleagues to visit Hall A3, Booth 210 to exchange ideas and explore cooperation.


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